Karl Herd, Oskarverleihung 2008


For applications in electronic component production we offer tape and reel packing (blister tape) of your stamping parts according to DIN IEC 286. Packing is performed in-house.

We offer our customers taping of standard and non-standard components; taping of active and passive components as well as taping of radial and axial components.
Our services at a glance:

  • Taping of ICs on precision carrier tapes
  • Taping of Quad Flat Packs / QFPs
  • Bake and dry of moisture-sensitive components
  • Taping of active & passive components
  • Taping of non-standard components
  • Vacuum packing of the taped ICs in MBBs
  • Taping of radial components
  • Taping of axial components


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