For applications in electronic component production we offer tape and reel packing (blister tape) of your stamping parts according to DIN IEC 286. Packing is performed in-house.
We offer our customers taping of standard and non-standard components; taping of active and passive components as well as taping of radial and axial components.
Our services at a glance:
- Taping of ICs on precision carrier tapes
- Taping of Quad Flat Packs / QFPs
- Bake and dry of moisture-sensitive components
- Taping of active & passive components
- Taping of non-standard components
- Vacuum packing of the taped ICs in MBBs
- Taping of radial components
- Taping of axial components